ligitek electronics co.,ltd. property of ligitek only pb lead-free parts led array la251b/g-3-pf data sheet doc. no : qw0905-la251b/g-3-pf rev. : a date : 13 - dec. - 2006
2.7 7.5 5.0 5.9 18.0min 0.5 typ 1 2 3 2.54typ 2.0min 2.54typ 2.0min 1.5 max 10.5 0.5 7.6 8.6 5.0 0.5 7.1 18.75 3.0 6.8 0.5 3.5 0.5 2.54typ 2.54typ 15.0 6.0 5.9 5.0 0.5typ 1.5 123 3.5 page 1/6 part no. la251b/g-3-pf package dimensions ligitek electronics co.,ltd. property of ligitek only lxg3392/r1-pf note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 1.cathode green 2.common anode 3. 2 1 3 g + - - + 1 23 g 3. 1.cathode green 2.common anode
ligitek electronics co.,ltd. property of ligitek only peak 565 wave length nm note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 typical electrical & optical characteristics (ta=25 ) operating temperature t opr p la251b/g-3-pf gap green emitted white diffused lens part no material color storage temperature tstg forward current i f power dissipation peak forward current duty 1/10@10khz reverse current @5v ir pd i fp parameter symbol -40 ~ +85 viewing angle 2 1/2 (deg) max. 301.72.6 min. 1.84.576 typ. min. forward voltage @20ma(v) spectral halfwidth nm luminous intensity @ ma(mcd) 10 -40 ~ +100 page2/5 30 ma 10 a 100 120 mw ma ratings g unit part no. la251b/g-3-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip 3/5 part no. la251b/g-3-pf
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) 2 /sec max 60 seconds max preheat 0 0 25 50 120 260 100 260 c3sec max 5 /sec max temp( c) time(sec) 150 ligitek electronics co.,ltd. property of ligitek only page 5/6 part no. la251b/g-3-pf note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above.
6/6 page ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. operating life test test item high temperature storage test low temperature storage test reliability test: 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs high temperature high humidity test thermal shock test 1.t.sol=230 5 2.dwell time=5 1sec solder resistance test solderability test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition part no. la251b/g-3-pf
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